Productronica Innovation Award 2017 winner Viscom X7056-II 3D AXI in-line system can ensure precise inspection of hidden solder joints and components in high-volume production. 

The Viscom X7056-II systems offers a unique machine that combines 3D AOI with fully automated X-ray. It is the most efficient and total defect coverage systems ever created. 


Combined 3D AOI + X-ray


    • Revolutionary handling concept xFastFlow for printed circuit boards change in as little as 4 seconds
    • Ultra thorough inspection of single or double-sided electronic assemblies
    • System can be used as a 3D AXI system or 3D AXI/3D AOI combination
    • Three different flat panel detector sizes for scalable throughput
    • Versatile and adaptable inspection depth
    • Additional vertical slices for optimum analyses and dependable verification
    • Viscom Quality Uplink: Effective networking and process optimization
    • Comprehensive IPC-compliant AXI inspection library
    • High-quality 3D AXI volume calculation with planar CT
    • Highest in-line AXI resolution for the best defect coverage and detection

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