Award wining Viscom X7056-II 3D AXI in-line system can ensure precise inspection of hidden solder joints and components in high-volume production.
The Viscom X7056-II systems offers a unique machine that combines 3D AOI with fully automated X-ray. It is the most efficient and total defect coverage systems ever created.
Combined 3D AOI + X-ray
- Revolutionary handling concept xFastFlow for printed circuit boards change in as little as 4 seconds
- Ultra thorough inspection of single or double-sided electronic assemblies
- System can be used as a 3D AXI system or 3D AXI/3D AOI combination
- Three different flat panel detector sizes for scalable throughput
- Versatile and adaptable inspection depth
- Additional vertical slices for optimum analyses and dependable verification
- Viscom Quality Uplink: Effective networking and process optimization
- Comprehensive IPC-compliant AXI inspection library
- High-quality 3D AXI volume calculation with planar CT
- Highest in-line AXI resolution for the best defect coverage and detection