Soldering Reflow

Selection of standone and inline

Hot Air Convection Reflow and

Vapor Phase Reflow

 
 

Convection or Vapor phase?

With convection reflow machines hot air is pushed via fans thru heating elements to heat up the substrate. This process is widely used and offer solutions to the majority of soldering requirements. 

With vapor phase reflow the substrates are lowered in a vapor blanket to assure an evenly heat up without overheating. They are frequently used for complex soldering requirements

Start up convection

The BT301 table top systems use hot air and IR soldering. Ideal for prototyping labs and R&D companies.  

PCB size 350x240mm

Economy convection

The Essemtec RO300 is a versatile reflow oven for low to mid volume soldering. Integrated microprocessor for profile control and storage. 

 

Machine Length 2000mm

Heated Length 1160mm

The Autotronik BS551 reflow oven for medium volume soldering features 8 heating elements for high air volume soldering of substrates.

Machine length 2010mm

Heated Lenght 850mm

The Essemtec RO400 reflow oven for medium volume soldering features 5 heating elements for high air volume soldering of complex boards.

 

Machine Length 2800mm

Heated Length 1620mm

Premium convection

The Zonda Reflow ovens powered by Heller offer a full range of high volume machines with 7 to 12  heating zones. It combines mesh belt with pin chain and width of up to 600mm. 

 

PCB width up to 600mm

 

Start up vapor phase

The DFA VP series are very affordable systems for prototype and start up companies with limited SMT production. Its simple fast set up ensures a quick ready for use  

PCB size up to 430x230x20mm

The IBL Minilab is made for prototype and controlled soldering results and utilizes the patented vibration free transport system.   

PCB size 300x275x80mm

Economy vapor phase

The IBL SV260 dual chamber vapor phase is ideal for prototype and small series with live temperature monitoring.

 

PCB size 300x260x80mm

The IBL SV540 dual chamber vapor phase is made for small to mid volume with integrated fluid filter and solder monitoring.

 

PCB size 560x360x80mm

Premium vapor phase

The IBL BLC series is the most accurate machine to fully monitor and adjust the soldering profile. It offers various patented technical features and is the choice the most extreme soldering challenges. 

 

PCB size up to 850x540x80mm

The IBL CX series is the fully automated inline vapor phase soldering solution. It provides precise, high quality results at medium to high volume throughput. 

 

PCB size up to 825x650x80mm

Vacuum vapor phase

The IBL VAC series is similar to the premium range BLC but in addition offers a patented in vapour vacuum system for perfect void free soldering results. 

 

PCB size up to 635x644x70mm

 

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