Selection of standone and inline
Hot Air Convection Reflow and
Vapor Phase Reflow
Convection or Vapor phase?
With convection reflow machines hot air is pushed via fans thru heating elements to heat up the substrate. This process is widely used and offer solutions to the majority of soldering requirements.
With vapor phase reflow the substrates are lowered in a vapor blanket to assure an evenly heat up without overheating. They are frequently used for complex soldering requirements
Start up convection
The Zonda Reflow ovens powered by Heller offer a full range of high volume machines with 7 to 12 heating zones. It combines mesh belt with pin chain and width of up to 600mm.
PCB width up to 600mm
Start up vapor phase
Economy vapor phase
Premium vapor phase
The IBL BLC series is the most accurate machine to fully monitor and adjust the soldering profile. It offers various patented technical features and is the choice the most extreme soldering challenges.
PCB size up to 850x540x80mm