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Versatile reflow oven for low volume soldering (leadfree or leaded solder). 300 mm process width. Integrated microprocessor for profile control and storage. 

Convection Low Volume - RO300

    • 4 zone reflow oven
    • 300mm process width
    • Compact Footprint
    • Mesh belt or Pin chain
    • Low Delta T
    • Low power consumption 
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