Versatile reflow oven for low volume soldering (leadfree or leaded solder). 300 mm process width. Integrated microprocessor for profile control and storage. 

Convection Low Volume - RO300

    • 4 zone reflow oven
    • 300mm process width
    • Compact Footprint
    • Mesh belt or Pin chain
    • Low Delta T
    • Low power consumption 

T +32 (0)16 436 742

F +32 (0)16 437 220

©2019 BY SMD-TEC.

Industriezone D124
Ter Heidelaan 54c
3200 Aarschot
Belgium

Smd Tec 10 years.jpg