Versatile reflow oven for low volume soldering (leadfree or leaded solder). 300 mm process width. Integrated microprocessor for profile control and storage.
Convection Low Volume - RO300
4 zone reflow oven
300mm process width
Compact Footprint
Mesh belt or Pin chain
Low Delta T
Low power consumption
Essemtec RO300 Datasheet - Contact us for more info
