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Your Roadmap for visiting        SMT Nürnberg 2018 

From 5 to 7 June 2018 come and meet us and our partners at the SMT Hybrid Packaging show in Nuremberg. 

For free entry tickets call us or leave a message at 

Hall 4-318: World premiere of the Tarantula 

Essemtec's Tarantula high-speed dispenser will have its world premiere at the SMT Nuremberg. The "Award Winning System" will be presented to the public for the first time. The machine is a further development of the successful Spider and Puma systems, which have been launched by Essemtec in the field of "Pick and Place and Dispensing" in the last two years.
Furthermore, the Line Solution, the Pick and Place Fox and Puma are presented, which can cover the range of prototype production up to high performance line of 50'000 cph. It is possible to run on the machines parallel pick and place and dispensing processes. We also show new technologies in cooperation with customers.

Hall 4A-122: Future-oriented inspection solutions in the smart factory

With its brand-new developments, Viscom enables a consistent reduction of real defects and prevention of false calls in electronics production – for the best FPY results!

Highlights at this years SMT include:

- Manual X-ray inspection with Cobot: The intelligent cobot operates the manual X-ray system with high precision. As a collaborative robot, it relieves employees to support the process, especially for random sample and prototype analyses.

-International prize-winning innovation establishes itself as future standard: The combined 3D AOI/3D AXI system X7056-II fulfills the shortest cycle times and outstanding inspection results for automatic in-line inspection. Thanks to the ultra-modern 3D technology, slice images are realized in a superb quality.

- Internet of Things (IoT) in the SMT line: You can call up real-time analytical reports from our SPI, AOI and AXI systems in real time on your mobile phone or tablet. The IoT-linked inspection systems deliver information about overall equipment effectiveness, unit counts as well as the live data stream showing actual events occurring on the machines. Viscom is a partner in this latest IPC project – the Connected Factory Exchange, in short: CFX. This project offers the first-ever open cloud-based platform for all machines in the SMT process.

The next stage in evolution of ultra-fast 3D AOI inspection: The new double track inspection system is conceived for high-volume production of demanding electronics. The shadow-free 3D solder joint inspection delivers true-to-life 3D representations in 360° perspective, to ensure unequivocal verification results.

Hall 4-456: Selective soldering from handload to high volume inline

Pillarhouse will exhibit the handload range of Selective Soldering Systems, with the Jade and the Pilot. This machine is perfect for small to medium batch hand-load operations wanting a high specification value option. Flexible and low energy consuming.

Hall 4-205: Best in Class Quality Vapor Phase soldering

IBL will be exhibiting it's full range of vapor phase machines Minilab, SV260, SV540, BLC420, BLC620, VAC745 and the new VAC745xi.


Furthermore IBL are at the Community Booth from the Fraunhofer IZM in Hall 5, Booth 434. We show our BLC620 inline-machine in live-production-line.

Hall 4-131 Contactless Component counter

The automated component recognition detects and counts the unknown building parts without external support within approx.10 seconds. This is the reason why customers decide for the CCX in a direct comparison to its direct competition. Its easy and intuitive operation by company employees and data safety supported by the intelligent database onsite provide optimal protection of also sensitive data.

  • Quad-Count – 4 Reels in only 20 seconds

  • Sticks & Trays - Counting (NEW Feature )

  • Artificial intelligence of the CCX database through automatic learning mode

  • Plausibility control

  • Counting of large components with high volume packaging

  • Drypack  - Exact counting in spite of overlays by interference factors

Hall 4A-320: Solutions for challenging printing processes

At the Productonica show Christian Koenen will be introducing new developments and innovative ideas on everything relating to stencil and screen technology as well as the printing process.  If you want to improve your process & quality then here is a stand where you need to stop.   

Your schedule for SMT Nurnberg:

Manufacturer             Machine types/processes                Location

Autotronik                   Pick & Place                                       4-230

Essemtec                     Pick & Place, Dispenser, Storage   4-318

Christian Koenen       Stencils                                               4A-320

Eutect                           Selective & Robot Soldering           4-131

Heraeus                       Solder paste, (conductive) glue     4-554

IBL                                Vapor Phase                                      4-205

Optical Control           Component Counter                       4-131

Pillarhouse                  Selective Soldering                          4-456

Stannol                         Solder wire, bars, flux                     4-211

Viscom                         Inspection AOI, SPI, X-ray                4A-122

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