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The Viscom iS6052 SPI combines the advantages of the market-leading AOI system with powerful 3D SPI sensor technology and inspects the solder paste deposits with the highest possible speed and precision. Even the most demanding assemblies with CSPs or micro BGAs are reliably inspected. All essential 3D features such as volume, height and form are recorded and checked, as are surface area, displacement and smearing. 

SPI - 3D Solder Paste Inspection

  • VISCOM iS6052 SPI offers reliable 3D SPI with Quality Uplink, process control and DualView

    • Precise control of all essential 3D features; calibration-free
    • Extremely high throughput due to FastFlow Handling
    • Integrated height tracking 
    • Viscom Quality Uplink: process optimization and first-pass yield increase
    • Simple process analysis with the Viscom Uplink Analyzer
    • Fast program generation 
    • Print optimization through interlinkage with printer (closed loop)
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